KIT Scientific Publishing

Im Shop suchen

43,00 €

inkl. 7 % USt. exkl. Versandkosten

Ying Chen

Deformation Behavior of Thin Metallic Wires under Tensile and Torsional Loadings

(Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie ; 26)

AutorChen, Ying

VerlagKIT Scientific Publishing, Karlsruhe

ISBN9783731500490

UmfangV, 158 S.

Veröffentlicht
am:
08.08.2013

Erscheinungs-
jahr
2013

VerfügbarkeitAktiv

Downloads:

Für Zitate bitte die folgende URL verwenden:
http://dx.doi.org/10.5445/KSP/1000035547

Abstract

Size effects are widely observed in the mechanics of materials at the micron scale. However, the underlying deformation mechanisms remain ambiguous, particularly in the presence of strain gradients. In this work, combined microstructural investigations and mechanical tests (tension and torsion) were conducted on polycrystalline gold micro wires to determine the influences of specimen size, grain size, strain rate and loading type on the deformation behavior of the wires.