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  • Micromechanical finite element simulations of crack propagation in silicon nitride

    Johannes Wippler

    Band 3 von Schriftenreihe Kontinuumsmechanik im Maschinenbau
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    Silicon nitride is used for challening applications like cutting inserts or forming rolls. The extreme strength and toughness of the material is achieved by an interaction between the microstructure and fracture behaviour on the microlevel. In order to understand these mechanisms, detailed unit cells have been defined and used for the determination of the effective fracture properties. The results have been used for the implementation of an effective continuum damage mechanics model.

    Umfang: 140 S.

    Preis: €41.00 | £38.00 | $72.00

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    Empfohlene Zitierweise
    Wippler, J. 2012. Micromechanical finite element simulations of crack propagation in silicon nitride. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000026004
    Wippler, J., 2012. Micromechanical finite element simulations of crack propagation in silicon nitride. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000026004
    Wippler, J. Micromechanical Finite Element Simulations of Crack Propagation in Silicon Nitride. KIT Scientific Publishing, 2012. DOI: https://doi.org/10.5445/KSP/1000026004
    Wippler, J. (2012). Micromechanical finite element simulations of crack propagation in silicon nitride. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000026004
    Wippler, Johannes. 2012. Micromechanical Finite Element Simulations of Crack Propagation in Silicon Nitride. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000026004




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    Weitere Informationen

    Veröffentlicht am 18. April 2012

    Sprache

    Englisch

    Seitenanzahl:

    160

    ISBN
    Paperback 978-3-86644-818-6

    DOI
    https://doi.org/10.5445/KSP/1000026004