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  • Deformation Behavior of Thin Metallic Wires under Tensile and Torsional Loadings

    Ying Chen

    Band 26 von Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
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    Size effects are widely observed in the mechanics of materials at the micron scale. However, the underlying deformation mechanisms remain ambiguous, particularly in the presence of strain gradients. In this work, combined microstructural investigations and mechanical tests (tension and torsion) were conducted on polycrystalline gold micro wires to determine the influences of specimen size, grain size, strain rate and loading type on the deformation behavior of the wires.

    Umfang: V, 158 S.

    Preis: €43.00 | £40.00 | $76.00

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    Empfohlene Zitierweise
    Chen, Y. 2013. Deformation Behavior of Thin Metallic Wires under Tensile and Torsional Loadings. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000035547
    Chen, Y., 2013. Deformation Behavior of Thin Metallic Wires under Tensile and Torsional Loadings. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000035547
    Chen, Y. Deformation Behavior of Thin Metallic Wires Under Tensile and Torsional Loadings. KIT Scientific Publishing, 2013. DOI: https://doi.org/10.5445/KSP/1000035547
    Chen, Y. (2013). Deformation Behavior of Thin Metallic Wires under Tensile and Torsional Loadings. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000035547
    Chen, Ying. 2013. Deformation Behavior of Thin Metallic Wires Under Tensile and Torsional Loadings. Karlsruhe: KIT Scientific Publishing. DOI: https://doi.org/10.5445/KSP/1000035547




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    Weitere Informationen

    Veröffentlicht am 8. August 2013

    Sprache

    Deutsch

    Seitenanzahl:

    181

    ISBN
    Paperback 978-3-7315-0049-0

    DOI
    https://doi.org/10.5445/KSP/1000035547