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Akanksha Bhutani

Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz

(Karlsruher Forschungsberichte aus dem Institut für Hochfrequenztechnik und Elektronik ; 93)

AutorBhutani, Akanksha

VerlagKIT Scientific Publishing, Karlsruhe

ISBN9783731509455

UmfangXVIII, 215 S.

Veröffentlicht
am:
17.10.2019

Erscheinungs-
jahr
2019

Verfügbarkeit04

Downloads:

Für Zitate bitte die folgende URL verwenden:
http://dx.doi.org/10.5445/KSP/1000095763

Abstract

This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.