TY - BOOK AU - Lindenmann, Nicole PY - 2018 TI - Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces AB - To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.Umfang: XXI, 222 S.Preis: €49.00 | £45.00 | $86.00 PB - KIT Scientific Publishing CY - Karlsruhe KW - Photonic Wire Bonding KW - optische Aufbau- und Verbindungstechnik KW - integrierte Photonik KW - Silizium-Photonik KW - photonic wire bonding KW - optical interconnects KW - photonic integrated circuits KW - silicon photonics SN - 978-3-7315-0746-8 DO - 10.5445/KSP/1000077963 SE - 256