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ISSN 1865-1100
Photonic integrated circuits (PIC) become increasingly important for numerous applications. Mass production of PIC has become widely available, but large-volume low-cost photonic packaging still represents a challenge. Additive micro-fabrication of free-form optical coupling structures is discussed as a concept to overcome this technology gap. Multi-photon 3D-lithography is used to fabricate dielectric waveguides ("photonic wire bonds", PWB) as well as facet-attached microlenses (FaML).
Umfang: XV, 265 S.
Preis: 49.00
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Ein wellenleiterbasierter Sensorchip wird demonstriert, der für Point-of-Care-Anwendungen geeignet ist. Der Biosensor wird mit Hilfe eines mathematischen Modells entworfen, mit dem die Sensitivität der Wellenleiter untersucht wird. Für die Lichteinkopplung in die Wellenleiter wird erstmalig eine neue Klasse von integrierten Laserquellen für sichtbare Wellenlängen untersucht. Die Funktionsfähigkeit des wellenleiterbasierten Biosensorchips durch Detektionsexperimente erfolgreich nachgewiesen.
A waveguide-based sensor chip is demonstrated that is suitable for point-of-care applications. The biosensor is designed using a mathematical model to investigate the sensitivity of the waveguides. A new class of integrated laser sources for visible wavelengths is being investigated for the first time for light coupling into the waveguides. The functionality of the waveguide-based biosensor chip is successfully demonstrated by detection experiments.
Umfang: XV, 190 S.
Preis: 44.00 €
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To keep up with the ever-increasing data transmission speed needs, data center interconnects are scaling up to provide multi-Tbit/s connectivity. These links require a high number of WDM channels, while the associated transceivers should be compact and energy efficient. Scaling the number of channels, however, is still limited by the lack of adequate optical sources. In this book, we investigate novel chip-scale frequency comb generators as multi-wavelength light sources for Tbit/s WDM links.
Umfang: XIV, 197 S.
Preis: 43.00 €
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Integrated photonic sensor systems are miniaturized, mass-producible devices that leverage the mature semiconductor fabrication technology and a well-established ecosystem for photonic circuits. This book aims at a holistic treatment of waveguide-based photonic sensor systems by analyzing photonic waveguide design, photonic circuit design and readout design. Across all levels, a special emphasis is given to system-level performance optimization under realistic environmental conditions.
Umfang: XVI, 249 S.
Preis: 47.00 €
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Novel THz device concepts and signal processing schemes are introduced and experimentally confirmed. Record-high data rates are achieved with a simple envelope detector at the receiver. Moreover, a THz communication system using an optoelectronic receiver and a photonic local oscillator is shown for the first time, and a new class of devices for THz transmitters and receivers is investigated which enables a monolithic co-integration of THz components with advanced silicon photonic circuits.
Umfang: XII, 210 S.
Preis: 47.00 €
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Major challenges in nanoparticle and nanocomposite development are the control of particle size and shape, and to achieve uniform particle dispersion. In this book, the application of optical coherence tomography (OCT) for nanocomposite and nanoparticle characterization is investigated. Industrial requirements are robustness, small system cost and size, and an open path towards parallelization. We design and investigate silicon photonic integrated OCT systems that comply with these requirements.
Umfang: XIV, 184 S.
Preis: 41.00 €
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Among the various elements of the silicon photonics platform, electro-optic IQ modulators play an important role. In this book, silicon-organic hybrid (SOH) integration is used to realize electro-optic IQ modulators for complex signal processing. Leveraging the high nonlinearity of organic materials, SOH IQ modulators provide low energy consumption for high-speed data transmission and frequency shifting. Furthermore, the device design is adapted for commercial foundry processes.
Umfang: XIV, 165 S.
Preis: €41.00 | £38.00 | $72.00
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Silicon-organic hybrid (SOH) modulators add a highly efficient nonlinear organic electro-optic cladding material to the silicon photonic platform, thereby enabling efficient electro-optic modulation. In this book, the application potential of SOH modulators is investigated. Proof-of-principle experiments show that they can be used for high-speed communications at symbol rates up to 100 GBd and operated directly from a field-programmable gate array (FPGA) without additional driver amplifiers.
Umfang: XIV, 171 S.
Preis: €41.00 | £38.00 | $72.00
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A short introduction to the theory of surface plasmon polaritons (SPPs) is given. The application of the SPPs in on-chip signal processing is discussed. In particular, two concepts of plasmonic modulators are reported, wherein the SPPs are modulated by 40 Gbit/s electrical signals. Phase and Mach-Zehnder modulators employing the Pockels effect in electro-optic organic materials are discussed. A few micro-meter long SPP absorption modulator based on a thin layer of indium-tin-oxide is reported.
Umfang: XII, 171 S.
Preis: €43.00 | £40.00 | $76.00
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Umfang: XXI, 222 S.
Preis: €49.00 | £45.00 | $86.00
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