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Nicole Lindenmann

Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

(Karlsruhe Series in Photonics & Communications ; 21)

AutorLindenmann, Nicole

VerlagKIT Scientific Publishing, Karlsruhe

ISBN9783731507468

UmfangXXI, 222 S.

Veröffentlicht
am:
09.02.2018

Erscheinungs-
jahr
2018

VerfügbarkeitAktiv

Downloads:

Für Zitate bitte die folgende URL verwenden:
http://dx.doi.org/10.5445/KSP/1000077963

Abstract

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.